Publications de
Zhibin Yang, Kai Hu, Yongwang Zhao, Dianfu Ma, Jean-Paul Bodeveix
AADL Model Verification by Translating into TASM
Dans : Journal of Software, Institute of Software Chinese Academy of Science (ISCAS), China, Vol. 26, N. 2, p. 1-20, février 2015.
Zhibin Yang, Kai Hu, Dianfu Ma, Jean-Paul Bodeveix, Lei Pi, Jean-Pierre Talpin
From AADL to Timed Abstract State Machines: A Verified Model Transformation
Dans : Journal of Systems and Software (JSS), Elsevier, Vol. 93, p. 42-68, juillet 2014.
Zhibin Yang, Lei Pi, Kai Hu, Zong-Hua Gu, Dianfu Ma
AADL: an Architecture Design and Analysis Language for Complex Embedded Real-time Systems
Dans : Journal of Software, Institute of Software Chinese Academy of Science (ISCAS), China, Vol. 21, N. 5, p. 899-915, mai 2010.
Accès : http://www.jos.org.cn/ch/reader/view_abstract.aspx?file_no=3700&flag=1
BibTeX
Zhibin Yang, Jean-Paul Bodeveix, Mamoun Filali, Hu Kai, Dianfu Ma
A Verified Transformation: From Polychronous Programs to a Variant of Clocked Guarded Actions (regular paper)
Dans : International Workshop on Software and Compilers for Embedded Systems (SCOPES 2014), Sankt Goar, Germany, 10/06/14-11/06/14, ACM : Association for Computing Machinery, SCOPES ’14, p. 128-137, juin 2014.
Zhibin Yang, Hu Kai, Jean-Paul Bodeveix, Lei Pi, Dianfu Ma, Jean-Pierre Talpin
Two formal semantics of a subset of AADL (regular paper)
Dans : UML&AADL, Las Vegas, 27/04/11-27/04/11, IEEE Computer Society, ICECCS ’11, p. 344-349, avril 2011.
Zhibin Yang, Kai Hu, Lei Pi, Jean-Paul Bodeveix, Dianfu Ma
Formal Semantics and Verification of AADL Modes in Timed Abstract State Machine (regular paper)
Dans : International Conference on Progress in Informatics and Computing, Shanghai, China, 10/12/10-12/12/10, Vol. 2, IEEExplore digital library, p. 1098-1103, décembre 2010.
Zhibin Yang, Lei Pi, Kai Hu, Dianfu Ma
Towards a Formal Semantics for the AADL Behavior Annex (regular paper)
Dans : Design, Automation and Test in Europe (DATE 2009), Nice, 21/04/09-23/04/09, IEEE : Institute of Electrical and Electronics Engineers, p. 1166-1171, avril 2009.